A New Office for a New Era


After more than 30 years of operation at the same address in São Paulo, Brazil, Hexagon brand SISGRAPH has moved to a new location on Brigadeiro Faria Lima Avenue, one of the most important business and financial corridors in São Paulo.

The new office reflects SISGRAPH’s image as a global high-tech company and follows the architectural trend of an open work environment, promoting collaboration and total interaction between teams. In addition, the new building is LEED (Leadership in Energy and Environmental Design) certified.

SISGRAPH will continue to provide Intergraph’s high-end solutions to meet demand in Brazil and other South American countries for onshore and offshore projects, GIS, outage and distribution and incident management.HXN_SP-23

The new office also will serve as the main business hub for Hexagon Solutions, developer of smart solutions that integrate technologies from various Hexagon brands. These smart solutions, which help manage design, planning and operations in a wide range of industries including agriculture, shipbuilding, construction and water systems and infrastructure, add value for Hexagon customers that goes beyond what each product delivers individually, providing integrated, high-performance enterprise solutions.HXN_SP-21

We are looking forward to receiving customers and other visitors at our new innovative and dynamic office!

Enabling further growth and supporting the needs of our rapidly growing customer base throughout South America – that’s shaping smart change.


Claudio Simão
Hexagon Solutions


About Author

Claudio Simão

Claudio Simão is President of Hexagon Ventures and Chief Innovation Officer of Hexagon. He was previously a professor at Mackenzie University of São Paulo, Brazil, and a consultant for the Industry Federation and Brazilian government. Simão has published many articles and books on physics, dynamics of continuous systems and sensors and patents on instrumentation technology. Simão is a graduate of the University of São Paulo – USP, with a degree in mechanical engineering and physics.

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